ERSASCOPE M - Inspection System with 5 Mpix camera for BGA, CSP, Flip Chip, heel filling, THT throughput and other hidden solder joints.
High end endoscope inspection optics with 90° prism beam deflection (approx. 300 µm clearance)
6 movement axes for flexible adjustment to practically every required viewing angle
Antistatic Design
XY table with fine adjust wheels, freely positionable under the optics
BGA optics 90° with integrated LED light
0° MACROZOOM lens with integrated LED light
Battery-driven, dimmable LED fibre light
Ersacope stand
X-Y inspection table
Inspection software ImageDoc v3 (basic version)
Optimal light management:
- inspection heads with fibre optic stereo front light
Application - Inspection of concealed solder joints for gap dimensions 100 to 1,500 µm (BGA, PLCC, QFP etc.)