Dip & Print Station with squeegee

Brand: Ersa
Product code: 0PR100
Price:
525,00 €excl. VAT

The ERSA Dip & Print Station enables effective preparation of multiple component body types before rework. Fluxes or solder pastes can be applied to the landing areas precisely, reproducibly and very easy in handling.

Optional dip-in stencils allow for easy flux or solder paste dipping. This process is suitable for many BGA and Fine-Pitch-type SMD components. The component pins are simply dipped into a defined reservoir of flux gel or solder paste. Using a component-specific print stencil the pins of QFNs / MLFs or further SMD components can be printed very easily with a precise solder paste amount.

In the printing process the component is fixed to the stencil and printed with solder paste on

its bottom side. After flipping it back, the component is positioned on the PCB with the placement unit.

 

Adequate frame fixtures to attach the stencil frame of the Dip & Print Station to the placement unit are available for every ERSA rework system.

 

 

 

 

The list of accessories:

 

0PR100-D001 Dipping stencil 40 x 40 mm / 300 µm
0PR100-D002 Dipping stencil 20 x 20 mm / 150 µm
0PR100-D003 Dipping stencil 20 x 20 mm / 100 µm
0PR100-D004 Dipping stencil 40 x 40 mm / 100 µm
0PR100-D005 Dipping stencil 40 x 40 mm / 150μm
0PR100-PL550 Frame fixation PL 550
0PR100-PL650 Frame fixation PL 650
0PR100-R001 Squeegee 70 x 25 mm, 0.3 mm thick
0PR100-S001 Printing stencil, type 1, BGA 225
0PR100-S002 Printing stencil, type 2, MLF 32
0PR100-S003 Printing stencil, type 2, QFN 20

 

 

More info