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The ERSA Dip & Print Station enables effective preparation of multiple component body types before rework. Fluxes or solder pastes can be applied to the landing areas precisely, reproducibly and very easy in handling.
Optional dip-in stencils allow for easy flux or solder paste dipping. This process is suitable for many BGA and Fine-Pitch-type SMD components. The component pins are simply dipped into a defined reservoir of flux gel or solder paste. Using a component-specific print stencil the pins of QFNs / MLFs or further SMD components can be printed very easily with a precise solder paste amount.
In the printing process the component is fixed to the stencil and printed with solder paste on
its bottom side. After flipping it back, the component is positioned on the PCB with the placement unit.
Adequate frame fixtures to attach the stencil frame of the Dip & Print Station to the placement unit are available for every ERSA rework system.
The list of accessories:
| 0PR100-D001 | Dipping stencil 40 x 40 mm / 300 µm |
| 0PR100-D002 | Dipping stencil 20 x 20 mm / 150 µm |
| 0PR100-D003 | Dipping stencil 20 x 20 mm / 100 µm |
| 0PR100-D004 | Dipping stencil 40 x 40 mm / 100 µm |
| 0PR100-D005 | Dipping stencil 40 x 40 mm / 150μm |
| 0PR100-PL550 | Frame fixation PL 550 |
| 0PR100-PL650 | Frame fixation PL 650 |
| 0PR100-R001 | Squeegee 70 x 25 mm, 0.3 mm thick |
| 0PR100-S001 | Printing stencil, type 1, BGA 225 |
| 0PR100-S002 | Printing stencil, type 2, MLF 32 |
| 0PR100-S003 | Printing stencil, type 2, QFN 20 |